Cu空心微球的精密连接技术

Precise bonding of Cu micro-sphere

以Cu作为代用材料,通过分解实验方法,研究了扩散连接各工艺条件对靶丸参数的影响关系,获得适宜的工艺参数(温度小于600℃,压强小于6 MPa,时间60 min)。据此,实际连接Cu半球并制备出Cu空心微球。采用白光干涉仪、扫描电子显微镜、微米X射线断层扫描机等仪器对样品进行测试,结果显示连接界面无明显缺陷,内表面粗糙度小于50 nm,内球面直径差值小于20μm,连接强度满足机械加工要求。

The beryllium-copper capsule is one of the candidate ignition capsules in National Ignition Facility Project. Preci- sion match and bonding is the crucial process in the preparation for this capsule. In this paper, the technique is researched for the Cu materials as a substitute for Be, and the optimum parameters are achieved（temperature under 600 ℃ , pressure less than 6 MPa, processing period more than 60 minutes）. Finally, the Cu capsule is matched, with a surface roughness less than 50 nm and an asymmetry of diameters less than 20 μm. Using scanning electron microscope, cracks and flows have not be detected in the section of the joint. The strength of bonding meet the requirements of the following machining.