摘要
有时印制板组装不得不面对含铅器件和无铅器件混装的问题。其中,含无铅BGA器件及其他有铅表面贴装器件的混装印制板的电子装联是难度较大的一种。为解决此难题,对混装组件工艺解决方案进行分析和比较,选择了混合焊接工艺并进行焊接试验。通过试制产品及进行一系列老化筛选试验验证其可行性、可靠性,得出了典型产品的混合焊接工艺解决方案。
Sometimes the PCB assembly has to face the problem of mixed lead-free and leaded components. Among them electronic assemblies of lead-free BGA devices and other leaded SMT components is difficult. In order to solve this problem, the hybrid soldering solutions are analyzed and compared. The hybrid soldering solution was selected and the soldering experiments were done. Through the manufacture of products and a series of aging and screening tests to verify its feasibility, reliability, the hybrid soldering solutions of the typical product was got.
出处
《电子工艺技术》
2014年第3期144-147,共4页
Electronics Process Technology
关键词
含铅器件
无铅器件
混装
电子装联
Leaded component
Lead-free component
Hybrid soldering
Electronic assemblies
