共熔溶剂型镀镍及镍基复合镀层工艺研究

Electrodeposition of Nickel and Its Composite Coatings in Deep Eutectic Solvents

在氯化胆碱和乙二醇型深共熔溶剂中加入NiCl2·6H2O的电解液体系中,电沉积制备Ni镀层。分析了镀层的微观结构,研究了沉积电压和电解质浓度对镀层形貌和性能的影响。SEM显示,随着电压和Ni2+浓度的增加,镀层表面Ni颗粒变大,镀层变得粗糙,其腐蚀电位均比基底的腐蚀电位更负,起到了阳极保护作用。还初步研究了Ni/CNT的复合电沉积,发现CNT未能进入镀层,这有待进一步研究。

Nickel was electrodeposited on a rinsed brass substrate from a basic choline chloride/ethylene glycol deep eutectic solvent containing NiCl2·6H2O. The microstructure of the copper coating was analyzed and the effect of eletrodepostion potential and Ni^2＋ concentration on the morphology of copper coating are investigated in details. With the increase of electrodepostion potential and Ni^2＋ concentration, the surface gets rougher observed by SEM. According to the results of the corrosion test, It can function as a anodic protection for the substrate. Also, a Ni/CNT composite was studied and no CNT was found in the coating which needs a further study.