基于电子散斑干涉技术的微变形场测量及残余应力分析

Micro-deformation Field and Residual Stress Measurement Based on Electronic Speckle Pattern Interferometry

基于电子散斑干涉原理搭建了测量试验平台,通过数字图像处理,得到电子散斑干涉条纹图像,实现了对一维微变形场的测量,对比测量结果与仿真结果,验证了该测量方法的可行性。结合盲孔法测量残余应力的原理,用电子散斑干涉装置取代盲孔法中的应变花来测量因钻孔产生的变形,并由此解残余应力。试验结果表明,基于电子散斑干涉技术的盲孔法残余应力测量系统简单,可行,高效,具有很大的工程应用价值。

To measure one dimensional micro-deformation field,an experimental platform based on the principle of electronic speckle pattern interferometry（ ESPI） is established,and speckle fringe pattern images are obtained by digital image processing. By comparing the displacement measured by this method with simulation results,its feasibility is proved. This paper proposes that the residual stress measurement method is combined with ESPI with hole-drilling method to get the value of residual stress. It showsd that the new method is of great engineering application value and its system has the advantages of simple structure,engineering feasibility and hign efficiency.