低压断路器主回路温升的仿真模型研究

Study on Simulation Model of Low-voltage Circuit Breaker Main Circuit of Temperature Rise

对某低压断路器主回路运用有限元分析软件ANSYS进行温度场模型搭建分析。建立主回路稳态温度场分析模型,对其通电温升进行仿真分析,发现导电桥和触头位置的温升最高,接线端处的温度最低,触头位置的最高温度没有超过触点材料的熔点,故不导致熔焊。确定主回路通电最高温升部位环节,能为优化设计低压断路器主回路结构提供了一定的参考。

The temperature field model is built on a low voltage circuit breaker main circuit by using finite element analysis software ANSYS. Established the analysis model of the steady temperature field of main circuit, the electric temperature simulation analysis, shows that the conductive bridge and the contact position of the highest temperature rise, temperatureterminal at minimum, no more than the highest temperature of contact position of the contact material melting point, so it does not lead to fusion welding. To determine the main loopelectrify the maximum temperature rise of site links, can provide some reference for theoptimization design of the main circuit structure of low-voltage circuit breaker.