机箱托架导轨胶膜粘接新工艺技术

New Technology of Case Bracket Guide Rail Film Bonding Process

对机箱托架导轨的材料选用聚四氟乙烯软带，粘接采用胶膜粘接工艺进行了全面研究，确定了胶膜粘接热压工艺参数：热压温度130～140℃，时间15～20min,压力3～4kg/cm2。对胶膜粘接工艺（新工艺）和胶黏剂粘接工艺（老工艺）进行了比较，结果表明：选用的胶膜粘接工艺参数合理，在最佳工艺参数条件下，胶膜粘接的剥离强度是胶黏剂粘接强度的1.5倍以上，工艺周期同胶黏剂粘接周期相比，缩短了70%以上，满足机箱托架导轨粘接要求，因此胶膜粘接工艺是托架导轨粘接首选。

A comprehensive study on using PTFE soft belt as the material of case bracket guide rail and the adhesive film bonding process as the bonding technology is carried out. And the hot pressing process parameters of adhesive film bonding are confirmed as follows：the hot pressing temper-ature, time and pressure is 130~140℃, 15~20min and 3~4kg/cm2 respectively. The adhesive film bonding process （new technology） and adhesive bonding process （old technology） are compared, the results showed that under the optimum process parameters, the peel strength of adhesive film bonding process is at least 1.5 times than that of adhesive bonding, and its cycle time reduces more than 70%. The adhesive film bonding process can meet the requirements of case bracket guide rail bonding;therefore it is the preferred choice.