摘要
本文简要介绍了外点火工艺在半导体生产中的作用及制备氧化膜中各种方法的特点比较。描述了THERMCO水平氧化炉外点火系统的三部分组成部件:加热器、点火器以及保护措施。具体分析了THERMCO水平氧化炉外点火系统在工艺过程中会触发的软件及硬件的保护事件:H2事件、O2事件、RATIO H2事件、PYRO LOW事件、HI H2 FL事件以及NO TORCH事件,同时描述了相关保护措施的调节方法及步骤。最后介绍了THERMCO水平氧化炉外点火工艺中常见故障的分析。
This paper briefly introduces the ignition function in the process of semiconductor manufacture and the characteristics comparison of various methods for preparing oxide film, describes the three components such as heater, igniter and protection measures of the THERMCO oxidation furnace ignition system, detailed analyses the software and hardware protections triggered in the technological process: the H2 event, 02 event, RATIO H2 event, PYRO LOW event, HI H2 FL events and NO TORCH events, meanwhile describes the related protective adjusting method and steps, and finally introduces the analysis of the common failures.
出处
《重庆电子工程职业学院学报》
2014年第2期149-151,共3页
Journal of Chongqing College of Electronic Engineering