固化剂用量对集成电路封装材料固化行为的影响

Effect of Curing Agent Content on Curing Behavior of IC Packaging Materials

用酚醛树脂为固化剂,2-甲基咪唑为固化促进剂,制备了集成电路封装用环氧树脂模塑料(EMC)。用非等温差示扫描量热法(DSC)研究了固化剂用量对EMC固化行为的影响。利用Kissinger,Crane和Ozawa方程计算出了EMC的固化活化能、反应级数等固化反应动力学参数,推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件。结果认为:随着固化剂用量增加,活化能降低;该研究为EMC塑料的配方优化和集成电路封装工艺提供了基础数据。

The epoxy molding compound（gMC） for integrated circuits（IC） packaging was prepared by using phenolic resin as curing agent, 2 methylimidazole as curing accelerator. The effecl of the content of the curing agent on curing behavior of EMC was investigaled by non-isothermal DSC methods. Based on Kissinger, Crane and （）za- wa method, the kinetic paramel.ers such as activation energy and reaction order of EMC curing reaclion were oblained. The characleristic temperatures of the curing process such as gel, curing and post-curing temperature were calculaled by extrapolation. The resuhs show that the activation energy reduces by increasing the content of the curing agenl. The basic data for the recipe optimal of the EMC and the determination of packa ging technologies of IC are obtained.