游离磨料线锯硅晶体表面质量和加工精度实验研究

Experimental Investigation on the Surface Quality and Machining Accuracy of Free-Abrasive Wiresaw Slicing Crystalline Silicon

通过进行游离磨料线切割硅晶体的正交试验,分析了各工艺参数对加工表面粗糙度和总厚度偏差的影响趋势。通过对试验结果进行了方差和显著性分析,找出了这些工艺参数对表面粗糙度和总厚度偏差影响权重大小,并得到一组最优的参数组合。结果表明:表面粗糙度随着走丝速度、初始张紧力、切割液浓度的增大而减小,随着进给速度的增大而增大。走丝速度、切割液浓度、进给速度对总厚度偏差的影响与对表面粗糙度的影响趋势基本一致,而随着初始张紧力的增大,总厚度偏差先减小后增大,且这些参数中,进给速度对表面粗糙度影响最大,而初始张紧力对总厚度偏差影响最大。

Basing on making orthogonal experiment in slicing Crystalline Silicon by free-abrasive wiresaw, the influence of various process parameters on the surface roughness and total thickness variation are analyzed. Variance and saliency of the results are also analyzed, the descending order of the impact on different parameters is found. Meanwhile, obtain a set of optimal combination of parameters.The research results show that the surface roughness decreases with the increasing of wire speed,initial wire tension and slurry concentration,while increases with the increasing of the table speed. The influence of wire speed,slurry concentration,table speed on the total thickness variation is the same as the influence of various process parameters on the surface roughness. Total thickness variation first increases and then decreases while increases with the increasing of the initial wire tension. The results also indicated that the impact of table speed on the surface roughness is the greatest. However the impact of initial wire tension on the total thickness variation is the greatest.