摘要
提出了一种新的机载电子设备风机散热结构,采用开放式风道提高散热效率。通过采用新型材料及工艺解决开放式结构的电磁密封、防尘设计等技术难点,成功地将开放式结构应用于机载环境条件。文中通过具体产品的设计实现过程,对开放式结构设计要求及注意要点进行了详细的阐述。
A new heat-dissipation structure with fan for airborne electronic equipment is provided which adopts open air duet to increase heat-dissipation efficiency. Technical difficulties such as electromagnetic seal and dustproof design are solved by applying open structure to airborne environment condition successfully. Design requirements and key points of the design of the open structure are introduced in detail by the implementation of specific products.
出处
《电子科技》
2014年第6期140-142,共3页
Electronic Science and Technology
关键词
机载环境
开放式结构
电磁密封
防尘设计
airborne environment
open structure
electromagnetic seal
dustproof design
