摘要
分层起泡是印制电路板(PCB)制造与装配中的一个常见问题,常见于焊接过程、偶尔见于PCB制程中;分层起泡涉及影响因素很多:板材来料、PCB加工、PCB装配加工、返工返修等。PCBA板件分层起泡的失效分析,对PCB制程预防及改善均有一定的参考意义。文章将对分层起泡的失效原因和分析方法进行讨论,以供参考、借鉴。
Delamination or blistering is a common problem during PCB manufacturing and assembly process. And normally we can see these phenomena in assembly process, sometimes we can see them in manufacturing process. Besides, there are so many facts that cause Delamination or blistering ,such as PCB raw materials, PCB manufacturing, PCB or PCBA reworking and repair and so on. The failure analysis of PCBA is of great signiifcance on prevention and improvement of PCB’s manufacturing process. So, here we will discuss about the methods of delamination’s analysis.
出处
《印制电路信息》
2014年第6期59-64,共6页
Printed Circuit Information
关键词
分层
起泡
失效分析
Delamination
Blistering
Failure Analysis
