多层复相共烧界面的应力形成及其对微结构的影响

Formation and Effects of Interfacial Stress on the Microstructures for Multilayer Cofired Systems

对复合多层厚膜共烧体在制备过程中应力的产生及其状态进行了理论分析 ,得出了厚膜材料不匹配的热力学特性是导致界面应力的重要根源。利用受约束形变的双层膜的应力模型对共烧多层复合陶瓷元器件在不同阶段的应力状态及影响因数进行讨论。阐述了改善界面热应力和界面缺陷的工艺措施 ;

This paper has made an analysis of the generation and state of stress during fabricating a multilayer composite cofired system,which indicates that the thermodynamic mismatch of the two thick films is the causes of interfacial stress.A discussion about the stress state and the influencing factors in the different stages for preparing composite cofired ceramic devices has been made by using a restrained two layer stress model.This includes some processing measurements for improving interfacial stress and defects.Moreover,some influences of interfacial thermal stresses on the microstructures of composite multilayer systems have also been studied.