摘要
本文提出了提高线结构光传感器测量分辨力的光学图像拆分与合成技术 ,即将光条所成的图像拆分成几部分 ,并分别成像在 CCD成像面上 ,在不降低分辨力的情况下 ,使测量视场单方向扩展。此技术已成功地应用于 BGA芯片管脚的三维测量。
This article presents an image splitting and splicing technology for improving resolution of line-structured laser sensor,which is to split the image of linear light into several sections and then form a spliced image on CCD camera sensitive area.Hence,unidirectional extension of the measuring field range is obtained without resolution reduction.This technique has been successfully applied in BGA chip leads'3-D measurement.
出处
《光电子.激光》
EI
CAS
CSCD
北大核心
2001年第1期55-57,共3页
Journal of Optoelectronics·Laser
基金
国家自然科学基金资助项目! (6 990 6 0 0 1)
关键词
线结构
光传感器
图像拆分
图像合成
line-structured laser sensor
image splitting and splicing technology
BGA chip
3-D measurement