高精度蓝宝石卧式粘料机设计

Design of high precision sapphire horizontal material sticking machine

针对在蓝宝石晶棒切割成片的过程中由于无法准确控制晶棒端面的晶向,导致晶棒切割成片后晶片精度达不到加工要求的问题,依据布拉格方程和晶体几何学原理,设计出了高精度蓝宝石卧式粘料机。该设备主要分为左右两部分:左侧包括一个轴向转动结构和滑动装置,可对晶棒端面的Y方向进行调节和修正;右侧主要包括一套压紧装置和水平调整机构,对晶棒端面的X方向进行调节。晶向调整好后直接在右侧的X光下进行准确粘接。经试验表明:切出的晶片晶向角度基本上都在正负3分以内,满足要求。

For cutting in the sapphire ingot piece of the process, because the crystal orientation can not accurately control the crystal face, resulting in ingot after wafer dicing, accuracy is not up to the requirements of processing problems, according to the Prague equation and the crystal geometry principle, design a high precision sapphire lying type material sticking machine. This equipment is mainly divided into two parts： the left side includes an axial rotation structure and sliding device, can Y direction on the ingot surface is adjusted and corrected. Right mainly includes a clamping device and the horizontal adjustment mechanism, the X direction of the crystal face adjustment. Crystal to adjust good empress directly on the right side of the X light for accurate adhesive. After a lot of experiments show that： wafer cut out to angle basically in the positive and negative within 3 points, to meet customer requirements.