叠层埋入式电阻温度分布的影响因素分析

Analysis of the influence factors on temperature distribution of stack embedded resistors

选取方阻阻值、电阻表面积、电阻层间距、电阻距PCB板表层距离、同层电阻间距和电阻电流作为影响温度分布的关键因素,基于正交表L25(56)设计并建立了25种不同参数水平组合的叠层埋入式电阻有限元模型进行温度场分析,对所得25组温度数据进行极差分析和方差分析。结果表明:方阻阻值对温度影响最大,其次是电阻表面积、电阻电流、同层电阻间距、电阻距PCB板表层距离,最后是电阻层间距;在置信度为90%时,方阻阻值对温度有显著影响。

Sheet resistance, resistor surface area, distance between the stack embedded resistor layers, distances between the surface of PCB and first layer of embedded resistor layers, distance between the stack embedded resistors in the same layer and current magnitude were selected as six key factors, which affected the temperature distribution. By using L25（56） orthogonal array, the 25 stacked embedded resistor finite element analysis models which had different configuration parameters＇ levels combinations were designed. Simulation analysis of temperature field was carried out by using these models. The data of temperatures of stacked embedded resistors were analyzed by range analysis and variance analysis. The results show that sheet resistance, resistor surface area, current magnitude, distance between the stack embedded resistors in the same layer, distance between the surface of PCB and first layer of embedded resistor layer and distance between the stack embedded resistor layer affect the temperature in a descending order. With 90% of confidence, sheet resistance has the most significant effect on the temperature.