6Mallory G O, Horhn T R. Electroless Deposition of Ternary Allory [J]. Metal Finishing,1979,66(4):40.
7U S Pat. 5085693 [P].1992-02.
8Wong K, Chik, Rongappan. Application of Electroless Plating in the Semiconductor Microcircuit Industry [J].Plating and Surface Finishing,1988,75(7):70.
9林忠夫 东京.无电解めつき基础と应用[M].日刊工业新闻社,1994..
10Chad M. Miller,Iver E. Anderson,Jack F. Smith. A viable tin-lead solder substitute: Sn-Ag-Cu[J] 1994,Journal of Electronic Materials(7):595～601
