基于SU8厚胶制备折叠波导的工艺研究

Process Study on Folded Waveguide Microfabricated with SU-8 Photoresist

随着太赫兹(THz)技术的发展,真空电子器件越来越小型化,作为核心部件的折叠波导由于具有独特的优点,在高频结构中必将得到广泛的应用。开展了基于SU8厚胶,采用嵌丝式UVLIGA工艺制备折叠波导(FWG)互作用结构的工艺实验,主要包括无氧铜基体的制备、SU8厚胶的匀胶、烘胶、光刻、后烘、显影等工艺参数的摸索。

Vacum electronic devices are smaller and smaller with the development of THztechnology,the folded waveguide will be widely used in vacuum devices because of its upstandingcapability. This paper fabricated circuits structures for folded waveguide utilized embeddedmonofilament UV-LIGA techniques. Mainly technical process include substrate design,coat,softbake,UV-exposure, postbake, development and so on.