高导热EP/铜粉导电胶的研制

Study on preparing EP/copper powder conductive adhesive with high thermal conductivity

以双酚A型环氧树脂(EP)为基体树脂、双氰胺为固化剂、咪唑为固化促进剂、纳米铜粉为导电填料和γ-氨丙基三乙氧基硅烷(KH-550)为硅烷偶联剂,并添加适量的氮化硼(BN)填料以及流平剂等其他助剂,制备了高导热EP/铜粉导电胶。研究结果表明:采用单因素试验法优选出制备高导热导电胶的最佳工艺条件是m(EP)∶m(双氰胺)∶m(咪唑)∶m(铜粉)∶m(KH-550)∶m(BN)∶m(流平剂)=100∶10∶0.5∶50∶1∶1∶0.1、固化温度为125℃和固化时间为0.5 h,此时其体积电阻率为0.09Ω·cm、导热系数为0.550 W/(m·K)和拉伸强度为562.07 MPa。

With bisphenol A type epoxy resin（EP） as matrix resin, dicyandiamide as curing agent, imidazole as curing catalyst, nano-copper powder as conductive filler, and T-aminopropyl triethoxy silane （KH-550） as silane coupler, then adding appropriate amount of boron nitride （BN） filler, flatting agent and other additives, an EP/eopper powder conductive adhesive with high thermal conductivity was prepared. The research results showed that the optimal process conditions of preparing conductive adhesive with high thermal conductivity were preferred by single-factor experiment method when mass ratio of m （EP） ：rn （dieyandiamide） ： m （imidazole） ：m （copper powder） ： m（KH-550） ： m（BN） ： re（flatting agent） was 100： 10： 0.5： 50：1 ： 1 ： 0.1 ,curing temperature and curing time were 125 ℃ and 0.5 h respectively. At the moment, the volume resistivity was 0.09 Ω·cm, the thermal conductivity was 0.550 W/（ m· K）, and the tensile strength was 562.07 MPa of the conductive adhesive.