3D片上光互连网络研究(本期优秀论文)

Study of 3D on-chip optical interconnection network

介绍了片上光互连的优势及其几个重要器件,并分析其网络的基本单元、开关网络结构和3D互连结构,提出了现阶段最主要的技术问题及其未来研究方向集中在片内光源的研制和片外光源耦合、互连网络功耗和温度的控制、互连网络结构和路由算法的优化三方面。

The advantages of the on-chip optical interconnect and its several important components are introduced.The basic unit of the on-chip optical interconnection network, structure of switching network and three-dimensional on-chip optical interconnection are analyzed. Moreover, the present stage the main technical problems and future research direction of optical interconnection network are proposed ,which are mainly concentrated in the design of the light source inside and coupling of outside light, the power consumption and temperature control, optimizing the interconnection network structure and routing algorithm.