摘要
研究了拉伸的Cu-Ag复合线材在不同温度的扩散条件下界面区域的微观组织和扩散行为。随着扩散温度的升高,Cu、Ag基体中发生再结晶及晶粒粗化,最终在两侧基体中出现部分孪晶。700℃扩散处理后基体中界面两侧开始出现扩散层,当温度达到800℃时,在Cu/Ag界面出现连续分布的富Cu的共晶扩散层。
The diffusion behavior.of Cu-Ag composite wire during extrusion and drawing process was investigated. The morphologies of Cu/Ag interface at different diffusion temperatures were observed. As the temperature in-creased, recrystallization and grain coarsening occurred at areas of Cu and Ag. Moreover, annealing twins appeared onboth side of interface. The diffusion layers formed at 700 ℃ at interface, while continuous rich-Cu eutectic diffusionlayers grew up at 800℃.
基金
国家自然科学基金(51031002)
