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基于石墨烯开发的高分子复合材料在电磁屏蔽领域中的应用 被引量:4

Graphene based composite for electromagnetic interference shielding
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摘要 电子与通讯设备广泛地应用于工业、商业、科学研究以及军事等领域,电磁辐射对人体健康造成不良的影响,使得电磁屏蔽一直是现代社会需要重视的一大问题,因此也催生了对不同类型的电磁屏蔽材料的制备与性能的研究.与传统的金属电磁屏蔽材料相比,以碳材料作为填料的高分子复合材料在电磁屏蔽领域有着自己独特的优势,包括重量轻、耐腐蚀、易加工、具有柔性以及可吸收频率范围广.石墨烯作为一种新型的二维纳米碳材料,具有极其优异的电学、力学和热力学性能,这些优异的性能使得石墨烯在与高分子材料形成复合材料后具有极佳的作为电磁屏蔽材料的潜质.此外,在航空航天、武器装备、军事防护、汽车工业以及微电子业中,对所使用的电磁屏蔽材料的热稳定性、力学性能也都有更高的要求.石墨烯-高分子复合材料比其他的含碳复合材料具有更大的优势来满足这些挑战.本文对应用于电磁屏蔽领域的石墨烯-高分子复合材料中石墨烯的制备方式进行分类,总结了目前此类复合材料的电磁屏蔽效能. Because of the wide use of commercial, military, and scientific electronic devices and communication instruments, electromagnetic interference (EMI) shielding of radio frequency radiation continues to be a serious concern for modern society. The preparation of EMI shielding materials has obtained an increased attention in the academic and industrial field. Compared to the conventional metal-based EMI materials, polymer conposites containing carbon-based nanofillers have their own advantages, such as being lightweight, resistance to corrosion, excellent processability, and broad absorption bandwith and flexible. Graphene, a new class of 2D carbon nanomaterials, possesses extraordinary electrical, mechanical, and thermal properties. These unique features offer great promise for its use in EMI shielding. Besides, for the application in special fields such as aerospace, weapon equipment, military protection, vehicles and microelectronics where the materials with superior thermal stability, excellent mechanical properties, perfect radiation, and electrical resistant performance are required, high performance graphene composites could be a better candidate to fulfill the task. In this review, EMI shielding graphene based composite were classified by the method of graphene preparation.
出处 《科学通报》 EI CAS CSCD 北大核心 2014年第18期1681-1687,共7页 Chinese Science Bulletin
基金 国家自然科学基金(51021001)资助
关键词 石墨烯 高分子 复合材料 电磁屏蔽 化学还原 热还原 化学气相沉积 graphene, macromolecule, composite, electromagnetic interference(EMI) shielding, chemical reduction, thermal reduction,chemical vapor deposition
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