摘要
本文研究了H2 O2 /Fe2 氧化偶合混凝法处理印刷电路板厂干膜废水。讨论了包括过氧化氢浓度、亚铁离子浓度、pH值、温度、时间和混凝 pH值等影响因素。试验结果表明 ,当过氧化氢浓度为 45 7 0mg/L、铁离子浓度为 40 0mg/L、氧化 pH值 4 0、反应温度为 40℃、反应时间 180min时 ,COD去除率达 84 7% 。
The treatment of dry film containing wastewater with oxidation coagulating method was studied Factors affecting Fenton reagent oxidation and coagulation, including the concentration of H 2O 2, the concentration of Fe 2+ , pH, temperature, time and coagulation pH, are discussed The experiment results showed the removal rate of COD reached 87 7%, when the concentration of H 2O 2 was 457 0mg/L, the concentration of Fe 2+ was 400mg/L, pH was 4 0, the time of the reaction was 180min, coagulating pH was 8~9, the quality of effluent could meet the standards
出处
《四川环境》
2001年第1期13-15,20,共4页
Sichuan Environment