镁合金化学镀镍的磷含量控制

Control of P Content in Electroless Ni Plating on Mg Alloy

改变化学镀镍层的磷含量可以使镀层适应于不同的工况要求。通过改变还原剂浓度、络合剂种类和浓度以及pH值 。

Change of P content in electroless Ni is required for different service environments and demands. By varying reductant concentration, species and concentration of complexing agent and bath pH, P content can be controlled in wide range, from low to high, on Mg alloy substrate.