期刊文献+

多晶硅薄膜晶体结构对薄膜压阻效应的影响 被引量:1

The Influence of Polysilicon Thin Film Crystal Structure Upon the Film Piezoresistive Effect
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摘要 本文研究了LPCVD多晶硅薄膜晶体结构对薄膜压阻效应的影响,通过改变淀积温度和膜厚得到晶体结构不同的薄膜,经硼离子注入掺杂,杂质浓度均为10^(25)/m^3用X 射线衍射法分析了薄膜晶体结构,悬梁实验测出薄膜应变系数GF 随淀积温度和膜厚的变化。理论分析表明,GF 不仅随晶粒度单调增加,而且与织构情况密切相关,不同织构压阻效应大小不同,〈100〉结构对薄膜压阻效应影响很大。理论结果较好地解释了薄膜GF 与淀积温度和膜厚的实验曲线. In this paper,the influence of the crystal structure of LPCVD polysilicon thinfilm upon the film piezoresistive effect has been researched.Changing the depositiontemperature and the film thickness,the different crystal structures of the film have beenobtained.The doping concentration is 10~25 ((?)/m)~3 in all the films by boron ionimplantation.The thin film structure has been analysed by means of the x—raydiffraction;the variations of polysilicon thin film Gauge Factor(GF)with depositiontemperature and film thickness have been studied by beam deflection method.The re-sult of theoretical analysis has shown that the film GF not only monotonously increaseswith crystalline grain size,but also closely related to the texture state,the piezoresistiveeffect is different for the distinct textures and the piegoresisitive effect of the〈100〉struc-ture in the thin film is the greatest.The experimental curves of thin film GF versus thedeposition temperature and film thickness have been explained theoretically.
出处 《哈尔滨工业大学学报》 EI CAS CSCD 北大核心 1993年第1期32-37,共6页 Journal of Harbin Institute of Technology
关键词 多晶硅 压阻效应 薄膜 晶体结构 Polysilicon piezoresistive effect Gauge Factor(GF)
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参考文献3

  • 1刘晓为,1988年
  • 2刘晓为,1988年
  • 3王善慈,传感器技术,1986年,6期,1页

同被引文献11

  • 1王钧.多晶硅压阻特性的探讨[J].复旦学报(自然科学版),1993,32(3):269-273. 被引量:1
  • 2霍明学,刘晓为,张丹,王喜莲,宋明浩.多晶硅薄膜的高温压阻效应[J].Journal of Semiconductors,2005,26(11):2115-2119. 被引量:5
  • 3Taher I,Aslam M,Tam or M A,et al.Piezoresistive Microsensors Using Ptype CVD Diamond Films[J].Senors and Actuators,1994:A45-35.
  • 4Malhaire C,Barbier D.Design of a Polysilicon on Insulator Pressure Sensor with Original Polysilicon Layout for Harsh Environment[J].Thin Solid Film,2003:427-362.
  • 5Wang M X,Meng Z G,Yitshak Zoha.IEEE Transactions on Electron Devices[J],2201,48:794.
  • 6刘晓为.多晶硅薄膜高温压阻性能研究[D].哈尔滨:哈尔滨工业大学,1988.
  • 7Liu Xiaowei, Chuai Rongyan, Song Minghao, et al. The In- fluences of Thickness on Piezoresistive Properties of Poly- Si Nanofilms [ C ]. Proceedings of SPIE Strasbourg, France,2006:0V 1 - 0V9.
  • 8Wang M X, Meng Z G, Yitshak Zoha. IEEE Transactions on Electron Devices [ J ] ,2201,48:794.
  • 9陆学斌,刘晓为,揣荣岩,施长治.掺杂浓度对多晶硅纳米薄膜应变系数及其线性度的影响[J].纳米技术与精密工程,2009,7(1):5-9. 被引量:3
  • 10王成龙,马军,范多旺,邢达,刘颂豪.铝诱导层交换超薄多晶硅薄膜制备及压阻特性[J].光谱学与光谱分析,2015,35(2):474-478. 被引量:4

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