摘要
用配有X-射线能谱仪的扫描电镜及光学显微镜观察了400℃、480℃及580℃,经不同时间,Ag膜/Cu块扩散对中Ag沿Cu晶界扩散诱发的晶界迁移(DIGM)现象。根据迁移晶界的特征,选用与其特征相适应的扩散方程教学解,计算了迁移晶界与静止晶界的扩散系数。
Using scanning election microscope equipped with X-ray energy dispersion spectrometer and optical microscope the phenomena of diffusion induced grainboundary migration (DIGM) caused by Ag diffusing along the grain boundaries of Cu in Ag(film) / Cu (bulk) diffusion couple annealed at 400℃ ,480℃ and 580℃ with various times was studied. Based on the characteristics of the migrated boundaries, the diffusion coefficient of Ag in the migrated grain boundary was calculated by an appropriate solution of the diffusion equation for the migrated boundary.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
1993年第1期48-54,共7页
Journal of University of Science and Technology Beijing
基金
国家自然科学基金(58971046)
关键词
银/铜系
DIGM
晶粒间界
晶界扩散
Ag / Cu system, DIGM, DIR, diffusion coefficient of the migrated grain boundary
