期刊文献+

异相陶瓷界面对多层陶瓷电容器介电特性的影响 被引量:3

Effects of Interfaces of Different Ceramic Phases on Dielectric Properties of MLCCs
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摘要 借助于电子显微镜和介温谱仪,研究了热稳定型复相多层陶瓷电容器中存在的异质、异相陶瓷界面的互扩散对其介电特性的影响。结果表明,异质界面之间存在明显的扩散层。其中不同铁电陶瓷之间过渡层的形成虽有助于改善电容器的容温特性,提高界面的粘接强度,但这也在一定程度上破坏了原先的结构设计,改变了元件的电容值。另外,由于不同铁电陶瓷相的烧结特性的不匹配易导致出现界面裂纹和空洞等共烧缺陷,从而提高了元件的介电损耗,相对疏松的界面易出现在涂覆端电极时镀液的渗入,降低了可靠性。 By means of scanning electron microscope and the impedance analyzer, the effects of interfaces among different ceramic phases on dielatric properties of composite MLCCs were investigated. The experimental results indicate that evident diffusion layers exist at the interfaces of different phases. On one hand, the formation of interfaces between dielectric ceramics with different Curie temperatures seem helpful to improve the permittivity-temperature characteristic of MLCCs and the adhesion intensity of interfaces, but it will destroy the original design of structure and then change the capacitance of parts. One the other hand, the cofiring defects, such as cracks, holes and so on, tend to appear because of the sintering mismatch between different ceramics, which will raise the dielectric loss. Relatively loosen niterfaces easily cause the paste leakage when electroplating the end electrode, degrading the reliability of MLCCs.
出处 《功能材料》 EI CAS CSCD 北大核心 2001年第2期196-197,共2页 Journal of Functional Materials
基金 国家自然科学重大基金!(59995523)
关键词 界面扩散 共烧 复相多层陶瓷电容器 介电特性 interface diffusion cofire composite multilayer ceramic capacitor
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参考文献4

  • 1Oh J H,Lee J H.Cho S H[].Ferroelectrics.1994
  • 2Butcher S,Chu M.Rae A[].Ceramic Industry.1997
  • 3J. G. Baek,K. Gomi,T. Isobe,M. Senna.by Controlled Concentration Gradient[].Journal of Materials Science.1997
  • 4Hennings D,Rosenstein G. Journal of the American Ceramic Society . 1984

同被引文献28

  • 1崔学民,周济,沈建红,缪春林.低温共烧陶瓷(LTCC)材料的应用及研究现状[J].材料导报,2005,19(4):1-4. 被引量:38
  • 2崔学民,周济,王悦辉,缪春林,沈建红.异质材料共烧匹配性调制在LTCC领域的研究进展[J].电子元件与材料,2005,24(10):50-55. 被引量:13
  • 3Ramesh Raghavendra,Pat Bellew,Neil Mcloughlin,et al.Characterization of novel varistor+inductor integrated passive device[J].IEEE Electron Device Lett,2004,25(12):778-780.
  • 4Francis J Toal,Joseph P Dougherty,Clive A Randall.Processing and electrical characterization of varistor-capacitor cofire multilayer device[J].J Am Ceram Soc,1998,81(9):2371.
  • 5Ramesh Raghavendra,Dundalk,Clive A Randall,et al.Integrated passive device and method for producing such a device[P].US-0043698,2002-04-18.
  • 6Ramesh Raghavendra.Coprocessing of electroceramics technology:a simple IPD for combined transient & EMI suppression applications[J].Featured Tech Pap,2002,13-34.
  • 7Sogabe Tomohiro,Enokido Yasushi.Multi-functional multilayer device and method for making[P].US-5870273,1999-02-09.
  • 8Alex Beiley.Miniature filter for digital receiver [J].IEEE MTT-S Digest Part,1997,(2):999-1002.
  • 9Dernovsek O,Naeini A,Preu G,et al.LTCC glass-ceramic composites for microwave application [J].J Eur Ceram Soc,2001,21:1693-1697.
  • 10Hongwei L,Barnes HL,Laskar J,et al.Application of digital PGA technology to K-band microcircuit and microwave subsystem packages [J].IEEE Trans Microwave Theory and Techniques,2000,48:2644-2651.

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