摘要
研制了一种用于扩散连接的金浆料。这种浆料主要由金粉和有机载体组成。浆料的烧成特性和粘度对扩散连接强度影响较大。金粉的分散性、表面形态和颗粒尺寸会影响浆料的烧成特性和粘度。载体会影响浆料的粘度。
A type of gold paste for diffusion bonding is developed. The paste is mainly composed of gold powder and organic vehicle. The properties of fired paste and the viscosity strongly affect diffusion bonding strength. The dispersibility, morphology and size of the gold powder particles greatly influence the properties of fired paste and viscosity. The vehicle influences the paste viscosity. The addition of platelet gold particles into paste can improve the diffusion bonding strength. (no refs.)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2001年第1期16-17,19,共3页
Electronic Components And Materials
