铜及铜合金化学抛光及钝化的研究

Study on Chemical Polishing and Passivation of Copper and Copper Alloy

研究了铜及铜合金化学抛光液及其钝化液的组成和工艺参数 ,讨论了抛光液各组分和抛光温度、时间、搅拌方式等工艺条件的影响。

Chemical polishing solution and passivation sloution of copper and copper alloy were studied.The effects of various component of the solution and technological parameters including polishing temperature,polishing time and the mode of agitation etc are discussed.In this paper,a new process of copper and copper alloy chemical polishing and passivation is introduced.