摘要
本文主要介绍了反渗透TFC卷式复合膜 ,在使用过程中常遇到的结垢现象 ,讨论了一些结垢本质及机理 ,并结合反渗透的情况对各种结垢可采取的一些措施、方法。
The fouling or scaling of wound TFC(Thin Film Composite) RO(Reverse Osmasis) membrane,which is often occurred during application,is introduced in the paper,the mechanism of scaling and the measure to clean or to avoid scaling are also discussed.
出处
《微电子技术》
2001年第2期61-64,共4页
Microelectronic Technology