印刷电路板微孔加工的问题及发展

Holes Machining on Printed Circuit Board

随着电器产品小型、轻量、高密度和高可靠性的要求,印刷电路极微孔加工的难度越来越大。本文对其冲孔和钻孔中孔径超差、毛刺和污斑的产生、钻孔位置偏离等现象及原因进行了分析,介绍了目前印刷电路板微孔加工的发展概况,比较了不同加工方法的优缺点,并介绍了专用微孔加工机床的性能、空气轴承主轴部件的应用、专用钻头的结构形状、材料和适用范围等问题。

Tiny holes machining on printed circuit board becames more and more difficult with the demand of small size,light weight,high density and good reliability of electrical equipments. In this paper,the author analyzes the reasons of overproof hole's diameter and burrs, smear as well as position of the holes during punching and drilling. the author also gives an account of the development of tiny holes machining on printed circuit board. meanwhile the author points out the properties of special machine tools for micrhole machining and describes the application of air bearings for high speed spindle, besides, the author introduces the structure, material and the applicable range of special drills.