用于微电子封装的化学镀纯镍工艺

Electroless Pure Ni Plating for Microelectronic Packaging

研究了一种能获得厚的纯镍化学镀溶液,讨论了溶液中各种化学成分、操作温度、稳定剂对沉积速度的影响,在此基础上确定了最佳配方及操作程序.对电子元件引线镀镍、镀金后的拉力进行了测试,对镀层硬度、方阻进行了测定.此方法适用于电子封装中W、Mo-Mn金属化及Cu、Ni、可伐等金属上的镀覆.

A new process for electroless pure nickel plating has been developed. The effects of the solution compositions, operating conditions and stabilizers on deposition rate are discussed. The process is suitable for plating of electronic packaging materials.