摘要
薄膜材料在集成电路、光电子技术、微结构传感器等微电子元件的应用日益广泛 ,其导热性能直接影响元器件的热噪声 ,进而对其可靠性和使用性能产生明显影响 .薄膜材料导热性能及其测试研究愈益受人瞩目 .为此 ,本文对薄膜材料导热性能及各种测试方法进行了综述 ,并在分析薄膜微结构模型的基础上 ,对计算薄膜有效热导率的不同预测方程进行了评述 。
Thin film materials have been widely used in micro electronic devices such as integrated circuits, photo-electron devices and microstructure sensors. Heat conduction behavior of these kinds of materials has direct influence on the thermal noises and hence the reliability and performance of the devices. Thermal conductivity is the most important thermal property which affects heat conduction in thin films. The present paper reviews the heat conduction behavior and the measureing techniques of thermal conductivity of thin film materials. Based on the analysis of the microstructure model, the computational formulae for predicting the thermal conductivity of thin films are discussed.
出处
《材料科学与工艺》
EI
CAS
CSCD
2001年第1期104-112,共9页
Materials Science and Technology
关键词
薄膜
热导率
测试
预测
导热性能
thin film
thermal conductivity
measurement technique
