混合式红外焦平面用对焊机的研制

The Development of Flip-Chip Alignment-Bonder Used in Hybrid IRFPA

对焊工艺是制备混合红外焦平面器件的关键工艺。本文介绍了我们根据对焊工艺要求自行研制的 HDD-1型红外对焊机的原理、性能及测试方法,并给出了该机在红外焦平面列阵对焊工艺中的试用结果。

It's necessary for fabrication of hybrid IRFPA to develop alignment bonding technique,A Flip-Chip Alignment-Bonder,type HDD-1 has been designed and produced.The principle,performance and applicaton in IRFPA technology are presented.