摘要
通过试验方法研究了快速凝固Sn -Ag -Sb合金在紫铜板上的润湿性能、填缝性能和组织特点 ,以及与保温时间等工艺因素的关系 。
By way of test, studied the wettability and the filling function of the high-speed solidifying Sn-Ag-Sb alloy at the red copper plate. The structural features of the soldered joint of this solder and the relation of this structural features to the various technological soldered such as holding time etc also were studied.And researched why the solder can densify the soldered.
出处
《焊接》
2001年第3期25-27,共3页
Welding & Joining
