摘要
脉冲溅射是一种新型的、用于消除直流反应溅射中异常放电的技术。通过采用金属铝靶和自制的脉冲电源进行了氧化铝薄膜的脉冲磁控反应溅射沉积实验 ,讨论了脉冲溅射参数对异常放电的抑制效果 ,以及对氧化铝薄膜的沉积速率和折射率的影响。
Pulsed sputtering is a new kind of technology used to eliminate the abnormal discharge during DC reactive sputtering.Aluminum oxide films were prepared by pulsed magnetron reactive sputtering with a metal aluminum target and a self-made pulsed power supply.The relation between the abnormal discharge's suppression and the pulsed sputtering parameters was given.The effects of sputtering parameters on the deposition rate and the refractive index of aluminum oxide film were also described in detail.
出处
《微细加工技术》
2001年第2期35-39,共5页
Microfabrication Technology
关键词
脉冲溅射
氧化铝薄膜
反射溅射
沉积
Pulsed Sputtering
Aluminum Oxide Film
Reactive Sputtering
