摘要
介绍了移动通信的发展动向和移动通信对半导体技术的要求。给出了具体的器件技术包括Ｓｉ双极晶体管、ＳｉＭＯＳＦＥＴ、ＧａＡｓＨＢＴ、ＨＪＦＥＴ和ＨＥＭＴ以及电路技术。
The tendency for mobile communication and the requirements of mobile communication to semiconductor techniques are presented.The indivi-dual devices ,including Si bipolar transistor ,Si MOSFET,GaAs HBT,HJFET,and HEMT,are addressed in detail ,as well as IC techniques.
出处
《半导体情报》
1995年第1期12-20,共9页
Semiconductor Information
