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用铝基钎料钎焊SiC陶瓷及其在SiC陶瓷表面浸润性的研究 被引量:5

Study on Brazing of SiC Ceramics with Aluminum base Filler Metals and Their Wettability on the Surface of SiC Substrates
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摘要 测定了在 10 -2 Pa真空度条件下Al- 2 8Cu - 5Si、Al - 10Si- 4Cu、Al- 12Si和Al -Si-Mg四种铝基钎料在反应烧结SiC陶瓷表面的润湿性 ,测定了用上述钎料钎焊SiC陶瓷的连接强度 ,探讨了润湿性和SiC陶瓷钎焊接头剪切强度的关系。结果表明 :四种钎料润湿性和接头剪切强度均随温度的升高和保温时间的延长而明显改善 ,Al-Si-Mg钎料润湿性最好 ;采用Al- 10Si- 4Cu钎料在 1373K、保温6 0min的条件下 ,接头剪切强度最高 ,为 15 3MPa。 Vacuum brazing process is used to bonding SiC ceramics using Al-28Cu-5Si,Al-10Si-4Cu,Al-12Si and Al-Si-Mg as fillers in this paper Concerning the effect of brazing temperature, holding time and alloying elements on the wettability and shear strength of SiC/SiC ceramics joint is investigated The results show that the wettability of four kinds of fillers on SiC substrates and the joint shear strength are all increased with the increasing of brazing temperature and holding time Al-Si-Mg filler metal shows the best wettability; the joint shear strength of SiC ceramics bonded with Al-10Si-4Cu alloy in the experimental conditions of this paper can reach 153 MPa
出处 《华东船舶工业学院学报》 EI 2001年第2期12-16,共5页 Journal of East China Shipbuilding Institute(Natural Science Edition)
基金 江苏省青年科技基金! (院编 986 0 6 )
关键词 铝基钎料 碳化硅陶瓷 浸润性 钎焊 连接强度 aluminum base filler metals silicon carbide ceramics wettability brazing bonding strength
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  • 1D. H. Kim,S. H. Hwang,S. S. Chun. The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys[J] 1991,Journal of Materials Science(12):3223~3234
  • 2M. G. Nicholas,D. A. Mortimer,L. M. Jones,R. M. Crispin. Some observations on the wetting and bonding of nitride ceramics[J] 1990,Journal of Materials Science(6):2679~2689

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