摘要
The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.
The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
2001年第5期453-456,共4页
Acta Physico-Chimica Sinica
基金
北京市自然科学基金!( 2982017)资助项目&&
