电子封装用金属基复合材料的研究现状

A Review of Metal-Martix Composites for Electronic Packaging

本文介绍了电子封装用金属基复合材料的研究现状 ,分别从基体、增强体、制备工艺几方面讨论了其对复合材料性能的影响 ,着重介绍了作为电子封装材料应用前景较好的高比例SiC颗粒增强铝基复合材料及其已部分实现规模工业化生产的铸造法。

In this paper,a review of Metal Matrix Composites(MMCs)for electronic packaging is presented,and various factors which influence the thermal properties of materials including matrix,reinforcement,processing method are discussed.Al-matrix composites with SiC particle reinforcements,which have good prospect of application,is emphatically introduced.Then,some problems that need further investigation are presented.