通信领域中的微机械谐振器件

Micro-mechanical resonant devices in the communication field

无线通信的发展要求系统中的无源器件小型化 ,以实现系统单片集成。微加工技术制作的无源器件不仅可以满足小型化要求 ,而且在 30 0kHz到 14 5MHz频段内 ,其品质因子 (Q值 )可高达 50 0 0 0。鉴于此 ,本文以表面加工技术、体加工技术以及键合技术制作的MEMS谐振器以及由它和耦合梁组成的滤波器为重点 ,介绍了它们的工作原理、设计和制作方法 ,最后讨论了在高频范围内制约MEMS谐振器件工作性能的因素。

The progress of the wireless communication requires the passive device in the system to be miniaturized to integrate whole system on a single chipThe MEMS passive device fabricated by micromachining technology can not only meet with this requirement,but its quality factor can also reach 50000 between 300kHz and 145MHzIn view of this,MEMS resonators and filters using both resonators and coupling springs fabricated by surface-micromachining technology,bulk-micromachining technology and bonding technology are mainly introducedTheir operation principle,design and fabrication process are presentedAt last,the factors that affect the performance of the devices at the high frequency are discussed