陶瓷基上化学镀铜

Electroless copper plating on ceramics

为提高化学镀铜液的稳定性 ,在化学镀铜液中加入亚铁氰化钾和a ,a’ -联吡啶作为添加剂。研究了温度与陶瓷基体上化学镀铜沉积速度的关系 ,计算出铜沉积的活化能。当镀液中含有亚铁氰化钾或a ,a’ -联吡啶时 ,铜沉积活化能提高 ,铜沉积速率降低 ,镀铜层外观及镀液稳定性均得到改善。此外 ,镀液中同时含有亚铁氰化钾和a ,a’ -联吡啶时 ,镀液、镀层性能得到进一步提高。

Potassium ferrocyanide and a,a'-dipyridine were added in electroless copper plating bath to improve the bath stability. Relationship between temperature and copper deposition rate on ceramics was studied, and the activated energy of copper deposition was calculated With the addition of potassium ferrocyanide and a, a'-dipyridine, the activated energy of copper deposition increased and copper deposition rate decreased, electroless copper plating is improved in deposit appearance and bath stability. Furthermore, better results can be obtained provided that potassium ferrocyanide and a,a'-dipyridine are used in combination.