摘要
研制出一种铜及其合金化学抛光新工艺。在传统的硫酸抛光液中加入一种淡绿色的粉末晶体。介绍了该抛光液的配制 ,研究了温度、基体材料对抛光效果的影响。结果表明 ,该工艺抛光速度快、腐蚀性低、无黄烟、环境污染小、成本低。
A new chemical polishing process for copper and its alloys was advanced which is composed of traditional sulfuric acid solution and a light green powder crystal. Preparation of the polishing solution was described. The effects of temperature, base materials on polishing results was studied. The results show that the process has strength such as fast rate of polishing, low corrosivity, no yellow fume produced, light environmental pollution and low cost.
出处
《电镀与涂饰》
CAS
CSCD
2001年第2期22-23,52,共3页
Electroplating & Finishing
