摘要
针对高压开关电触头烧结接合类型的触头 ,介绍了一种水浸聚焦超声 C扫描成像检测的方法 ,利用超声信号数字化采样技术来计算接头的接合率 ,可有效地控制高压开关烧结触头的结合质量。分析了触头检测时 ,不同入射面的检测结果有较大差异的原因。
To counter ratio of combining area of sintered contact of high voltage switch, an ultrasonic NDT & E imaging system is utilized. According to the feature of sintered contact, the calibration algorithm is used to counter the ratio of combining area. The experiments show that it is very effective to control the quality of high voltage switch.
出处
《高电压技术》
EI
CAS
CSCD
北大核心
2001年第3期47-49,共3页
High Voltage Engineering
