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关于镀镍光亮剂分子结构的探讨 被引量:1

Discussion on the Molecular Structure of Ni Plating Brightener
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作者 鞠传伟
出处 《电镀与环保》 CAS CSCD 2001年第3期16-17,共2页 Electroplating & Pollution Control
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  • 1陈永言,黄清安.电位扫描法研究氯化钾镀锌添加剂[J].材料保护,1995,28(9):1-4. 被引量:9
  • 2陈永言,喻敬贤,张红,杨勇,黄清安.氯化钾镀锌添加剂作用机理的研究[J].材料保护,1996,29(5):7-9. 被引量:8
  • 3喻敬贤,陈永言,黄清安.某些添加剂对锌在玻碳电极上电结晶的影响[J].武汉大学学报(自然科学版),1996,42(6):686-692. 被引量:6
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  • 5Weil R, Stanko G J, Moser D E. The formation of three dimensional, epitaxial crystallites during the electrocrystallization of nickel and their role in crystal-defect development[J]. Plat & Surf Fin, 1976, 63(9): 34.
  • 6Yu Jingxian, Chen Yongyan, Yang Hanxi, et al. The influences of organic additives on zinc electrocrystallization from KCl solution[J]. J Electrochem Soc, 1999, 146(5):1789.
  • 7Showchin Kou, Aina Hang. Studies of acid sulfate copper pulse reversal current electrodeposition[J]. Plat & Surf Fin, 2000, 87(5):140.
  • 8Scharifker B R, Hills G J. Theortical and exeperimental studies of multiple nucleation[J]. Electrochem Acta, 1983, 28:879.
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