摘要
研究了 Ni- Cu- P化学镀液主要成分、 pH值及时间等工艺参数对化学沉积 Ni- Cu- P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数,得到了 Cu含量从 0到 56.18wt%的 Ni- Cu- P合金镀层。利用 X射线能谱术 (EDS)和 X射线衍射术 (XRD)研究了镀液中硫酸铜浓度对 Ni- Cu- P合金镀层成分及组织结构的影响。在硫酸铜浓度低于 3g/l时, Ni- Cu- P合金镀层中 P含量高于 7.05wt%,合金镀层是非晶态结构。
Effects of the deposition parameters such as bath composition, pH and time on the element contents and deposition rate of the electroless Ni- Cu- P deposits were studied. The electroless Ni- Cu- P deposits with various copper contents from 0 to 56.18 wt% were prepared by choosing the proper deposition parameters. The effect of copper sulfate concentration in the bath on the composition and microstructure of the electroless Ni- Cu- P deposits was studied by X- ray energy dispersive spec- troscopy (EDS) and X- ray diffraction(XRD). Ni- Cu- P deposits with phosphorus content more than7.05wt% are amorphous, in the situation that the copper sulfate concentration in the bath is lower than3g/l.
出处
《功能材料与器件学报》
CAS
CSCD
2001年第2期191-194,共4页
Journal of Functional Materials and Devices
基金
国家九五科学仪器科技攻关资助