摘要
本文研究了激光微加工中常用的激光微细焊接和多脉冲打孔技术。着重论述了激光微加工的性能质量的检测手段与方法,分析了激光微加工的独特性能和它与电子束加工技术的区别。
In this paper, the laser microwelding and multipulse drilling technique are studied, which are frequently used for laser microprocessing. The diseussion is focussed on the means and method of measurements of properties of the laser microprocessing. Specific characteresties of the laser microprocessing and the difference between the laser beam and electron beam processing technique are analysed.
出处
《激光与红外》
CAS
CSCD
北大核心
1991年第6期33-36,共4页
Laser & Infrared
关键词
激光
微加工
焊接
打孔
显微图象
microprocessing, multi-pulse, welding, hole drilling/scanning electron micrograph