Ti/Ni/Ti复合层TLP扩散连接Si_3N_4陶瓷与接头质量控制

TLP diffusion bonding of Si_3N_4 ceramics using Ti/Ni/Ti multilayer and controlling of joints′ quality

研究了Ti/Ni/Ti复合层TLP扩散连接Si3 N4 陶瓷。结果表明 ,Ni Ti过渡液相存在时间短 ,在此期间形成的界面结合强度低 ;必须进一步固态扩散反应才能形成高强度接头 ,相应的接头显微结构为 :Si3 N4 /TiN/Ti5Si3+Ti5Si4 +Ni3 Si/NiTi/Ni3 Ti/Ni。连接时间、连接温度、连接压力及Ti和Ni的厚度影响接头组织和强度 ,其最佳值为 6 0min ,10 5 0℃、2 .5MPa、2 0 μm和 40 0 μm ,所得接头室温和 80 0℃剪切强度分别为 142MPa和 6 1MPa。

TLP diffusion bonding of Si 3N 4 ceramics with Ti/Ni/Ti multilayer was investigated.The existing time of Ni Ti transient liquid phase is short, and the strength of the interface formed within this duration is very low.The formation of strong joints needs further solid state diffusion reaction, and its microstructures is Si 3N 4/TiN/Ti 5Si 3+Ti 5Si 4+Ni 3Si/NiTi/Ni 3Ti/Ni. The joints′ strength is affected by bonding parameters, which include bonding time、bonding temperature、bonding presssure、thickness of Ti or Ni. The shear strength of joints at room temperature and 800℃ could reaches 142MPa and 61MPa, respectively.