MMIC封装管壳热传导效应的快速分析方法

An Improved Method for Analyzing Heat Conduction Effect of MMIC Package

本文应用有限差分法数值求解热传导方程分析封装管壳的热传导效应 ,利用广义特征值法建立温度计算值的复指数模型 ,用以拟合当前时间步并预测出以后时间步的温度变化特性 ,可以克服单纯应用有限差分法求解耗时巨大的缺点 ,从而大大提高计算效率。

The heat conduction effect of MMIC package is analyzed by solving the heat transfer equation using finite difference method in this paper.After some sampled values of temperature were calculated,the generalized eigenvalue method is used to set up the complex exponential model which is used to predict the temperature values after the present time step.The computation efficiency can be considerably improved using this method.