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一种连接双层传输线Via结构的全波分析 被引量：3

Full-Wave Analysis of a Via Connecting Two-Layered Transmission Lines
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摘要 推导了金属盒中介质平面上水平电偶极子和垂直电偶极子的格林函数 ,针对一种双层带状线或微带线的 Via结构建立了相应的电场积分方程 ,用矩量法计算了无调配装置和有调配装置的 Via的反射系数 ,并与其它方法作了比较。 The Green′s functions of horizontal and vertical electric dipoles on the dielectric slab of a metal enclosure have been derived. The Electric Field Integral Equation (EFIE) for a Via which connects two striplines or two microstrips in different dielectric layers has been given also. By the Method of Moments (MoM), reflection coefficients from the Via without or with matching strip line were calculated using EFIE.The results are compared with the measured ones given by another paper.
作者 史维华 王宗欣
机构地区 复旦大学电子工程系
出处 《微波学报》 CSCD 北大核心 2000年第5期485-492,共8页 Journal of Microwaves
关键词 电场积分方程 格林函数 双层传输线 Via结构 Electric Field Integral Equation (EFIE) Via Green's Function
分类号 TN42 [电子电信—微电子学与固体电子学]
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同被引文献39

  • 1姬五胜,肖建康,熊旭军.微波多芯片组件中垂直通孔互连的矩阵束矩量法仿真[J].微波学报,2005,21(6):23-26. 被引量：6
  • 2赵正平,苏世民.微组装技术的发展[J].半导体情报,1997,34(1):1-8. 被引量：9
  • 3[2]Said F.Al-sarawi,Derek Abbott,and Paul D.Franzon,"A review of 3-D packaging'Technology,"IEEE Trans.Components,Packaging,and Manufacturing echnology-Part B,vol.21,no.1,pp.2～14,1998.
  • 4[3]Geert J.Carchon,Dominique M.M.-P.Schreurs,et al.,"A direct Ku-Band linear subharmonically pumped BPSK and I/Q vector modulator in multilayer thin-film MCM-D,"IEEE Trans.Microwave Theory Tech.,vol.49,no.8,pp.1374～1381,2001.
  • 5[6]Robert H.Havemann,James A.Hutchby,"Highperformance interconnects:An Integration overview," Proceedings of the IEEE,vol.89,no.5,pp.586～601,2001.
  • 6[7]Albert E.Ruehli,Andrcas C.Cangellaris,"Progress in the methodologies for the electrical modeling of interconnects and electronic packages," Proceedings of the IEEE,vol.89,no.5,pp.740～771,2001.
  • 7[8]Edward Pillai,Werner Wiesbeck,"Derivation of equivalent circuits for multilayer printed circuit board discontinuities using full wave models",IEEE Trans.Microwave Theory Tech.,vol.42,no.9,pp.1774～1782,1994.
  • 8[9]Daniela Staiculescu,et al.,"Design rule development for microwave flip -chip applications,"IEEE trans.Microwave Theory Tech.,vol.48,no.9,pp.1476～1481,2000.
  • 9[10]Ryosuke Ito,Robert W.Jackson and Thongchai Hongsmatip,"Modeling of interconnections and isolation within a multilayered ball grid array package," IEEE trans.Microwavc Theory Tech.,vol.47,no.9,pp.1819～1825,1999.
  • 10[11]Anh-Vu H.Pham,Joy Laskar,et al.,"Ultra low loss millimeter wave multichip module interconnects," IEEE Trans.Components,Packaging,and Manufacturing Technology,vol.21,no.3,pp.302～308,1998.

引证文献3

二级引证文献8

微波学报
2000年 第5期

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