摘要
研究了铜合金 - Q195 -铜合金三层复合板室温轧制成形工艺 ,借助金相显微镜、扫描电镜。
The study was carried out on the compound technology of copper alloy/Q195/copper alloy cladding sheet,with room temperature rolling deformation.The bond mechanism of compound sheet was analysed by using optical,scanning electron microscope,electron probe.
出处
《热加工工艺》
CSCD
北大核心
2001年第3期34-36,共3页
Hot Working Technology
关键词
铜合金
室温轧制
三层复合板
结合机制
轧制复合
copper alloy
room temperature rolling
three ply cladding sheet
bond mechanism
